CONNECT WITH US
READ eBOOK
Sponsored

IC packaging material suppliers to capitalize on CoWoS surge

Julian Ho, Taipei; Rodney Chan, DIGITIMES Asia 0

Credit: TSMC

Semiconductor material suppliers are among the beneficiaries of robust demand from TSMC, Amkor Technology, and OSATs for CoWoS packaging, according to industry sources.

The premium content you are trying to open requires News database subscription. Please sign in if you wish to continue.