Global wafer foundry industry analysis and forecast, 2022

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Smartphone APs likely to adopt 3D chips after 2025

Julian Ho; Jingyue Hsiao, DIGITIMES Asia Friday 8 September 2023 0

Credit: AFP

Amid the AI frenzy, advanced packaging technology such as CoWoS has gained significant market attention, but smartphone APs based on 3D chiplet technology are expected to take off only after 2025.

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