Global wafer foundry industry analysis and forecast, 2022

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Intel delivers MCP prototypes to US Department of Defense

Jessie Shen, DIGITIMES Asia, Taipei Friday 7 April 2023 0

US Department of Defense headquarters in Arlington, Virginia. Credit: AFP

Intel has announced delivery of the first multi-chip package (MCP) prototypes created under the state-of-the-art heterogeneous integrated packaging (SHIP) program.

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Global wafer foundry industry analysis and forecast, 2022

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