TSMC expanding CoWoS packaging capacity

Monica Chen, Taipei; Jessie Shen, DIGITIMES Asia Thursday 7 September 2023 0

TSMC chairman Mark Liu at Semicon 2023. Credit: DIGITIMES

The shortfall in CoWoS packaging capacity at TSMC is temporary, and demand will be met in one and a half years via capacity expansions, according to company chairman Mark Liu.

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