The DIGITIMES Research special report you are trying to open is sold a-la-carte and is also available with Vehicle Tech Special Report Database services. Please sign in if you wish to continue.
After surveying and analyzing the showcases at Taipei AMPA & Autotronics Taipei 2023 and E-Mobility Taiwan 2023 held in mid-April, DIGITIMES Research found that this year's event had a growing number of high-voltage silicon carbide (SiC) semiconductor applications that significantly boost electrical vehicle (EV) efficiency, while the development of automotive electronics including mmWave radars, head-up displays (HUDs) and rear seat entertainment (RSE) systems are targeting mainly high-end applications.
Abstract
After surveying and analyzing the showcases at Taipei AMPA & Autotronics Taipei 2023 and E-Mobility Taiwan 2023 held in mid-April, DIGITIMES Research found that this year's event had a growing number of high-voltage silicon carbide (SiC) semiconductor applications that significantly boost electrical vehicle (EV) efficiency, while the development of automotive electronics including mmWave radars, head-up displays (HUDs) and rear seat entertainment (RSE) systems are targeting mainly high-end applications.
Thanks to the EV market's rapid growth, demand for high-power quick DC charging has started to emerge.
Concerning the development of SiC semiconductors that enhance EV efficiency, Foxconn subsidiary Hon Young Semiconductor (HYS) presented 1,200V SiC MOSFETs. HYS is aiming to increase its SiC capacity 10 folds by 2028 by working with upstream SiC substrate supplier Taisic Materials and is initially focusing on 6-inch wafer production and R&D on 8-inch wafers. Teco showcased a SiC high-power direct drive EV driver boasting a maximum power output of 360kW. The product can be applied in city-range e-buses and e-trucks with one of the e-buses set to adopt an 800V system that is set for volume production in 2024.
Table of contents
Price: NT$24,000 (approx. US$800)
