Global wafer foundry industry analysis and forecast, 2022

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Packaging capacity expansions to shore up IC leadframe demand

Julian Ho, Taipei; Rodney Chan, DIGITIMES Asia Tuesday 20 June 2023 0

Credit: DIGITIMES

IC leadframe demand is expected to grow sharply in the next several years, as a result of expansions of packaging capacity. Texas Instruments (TI), for example, has recently announced plans to expand its internal manufacturing footprint in Malaysia...

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