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Hybrid bonding and other new advanced assembly techniques widely used for smartphone application processors (AP) and high-performance computing (HPC) chips will continue to expand advanced packaging technologies.
Abstract
Flip chip (FC) and system-in-package (SiP) assembly remain the mainstream chip packaging technologies, while fan-out (FO) FO packaging was adopted for smartphone APs starting 2017 but it is still being used only for Apple processors at present.
However, with increasing maturity and decreasing costs, FO packaging is expected to be more widely used in smartphone APs in 2023. Furthermore, the Antenna-in-Package (AiP) module for mmWave-supported 5G phones is now based on FC packaging and is set to switch to FO packaging in 2023.
HPC chips integrate a growing number of arithmetic logic units and memory units to cope with the demand for stronger computing power. However, with increasing cost and difficulty in developing system-on-chip (SoC) solutions, HPC chip design making use of modular chiplets has become the way to go.
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