Server ODMs have begun large-scale shipments of AI servers equipped with Nvidia's H100 GPU in the third quarter; however, a shortfall in GPU supply may impact their deliveries, according...

According to semiconductor equipment suppliers, TSMC has reportedly begun its third wave of additional equipment orders since the second quarter, injecting life into the related equipment...

Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...

Benefitting from strong demand in the Japanese market and providing testing services to major customer TSMC, semiconductor testing giant Materials Analysis Technology's (MA-tek) Kumamoto...

Samsung Electronics regards artificial intelligence (AI) as a key innovation for next-generation home appliances, and starting from 2024, the company plans to equip all its new home...

These are the most-read stories on the DIGITIMES Asia website during the week of September 4–8:

TSMC saw its August revenue increase 6.2% to reach a 7-month high, while revenue at fellow company United Microelectronics (UMC) slipped 0.6% on month halting a 5-month streak of...

Akira Amari, leader of the parliamentary association to promote semiconductor strategy, participated in the "2023 Taiwan-Japan technology conversation" forum hosted by the Taiwan...

Affected by negative factors like a struggling economy and weak demand from the Chinese market, the 2023 global semiconductor market is being challenged. It's reported that the semiconductor...

Semiconductor material suppliers are among the beneficiaries of robust demand from TSMC, Amkor Technology, and OSATs for CoWoS packaging, according to industry sources.

General-purpose server demand remains sluggish despite strong demand for AI servers, according to sources at ODMs.

In the high-end OLED TV market, the importance of TV semiconductor technology continues to increase. Recently, not only has LG Electronics made market differentiations with its own...

To ensure their competitiveness, vertical integration isn't merely a catchphrase for businesses; it's an ongoing imperative. When TSMC focuses on advanced packaging, what's ASE's...

MediaTek has successfully developed its first chip utilizing TSMC's cutting-edge 3nm technology, taping out MediaTek's flagship Dimensity system-on-chip (SoC) with volume production...

The shortfall in CoWoS packaging capacity at TSMC is temporary, and demand will be met in one and a half years via capacity expansions, according to company chairman Mark Liu.