Recent statements by TSMC and Intel regarding their ambitious capital expenditure plans for advanced packaging have raised the bar for incumbent competitors and new entrants alike,...

Intel has invested a total of US$8 billion in Malaysia, and is committing an additional US$6 billion for the construction of new semiconductor facilities there, including a 3D advanced...

With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...

The importance of advanced packaging to the continuation of Moore's Law has already attracted TSMC and Intel to the field.

Since ChatGPT ignited a race among competitors to develop their generative AI system in early 2023, the high-computing power demand has pushed up the sales of AI GPUs.

The AI trend is now a worldwide phenomenon, with Nvidia CEO Jensen Huang even declaring that "Nvidia is betting everything on AI." In 2023, the AI server supply chain became one of...

LED leadframe specialist I-Chiun Precision Industry has stepped up efforts to improve its product mixes, with plans to enhance its heatspreader output for advanced packaging, according...

Amkor Technology is ramping up its capacity for advanced packaging production, with monthly output for 2.5D packaging expected to reach 5,000 wafers in the first half of 2024, up...

Semiconductor materials distributor Wah Lee Industrial has enjoyed robust orders catering to customers' advanced packaging needs, such as TSMC's CoWoS, as a result of the AI server...

Intel has struck a deal with the US Department of Defense to develop and manufacture chips with its 18A (18-angstrom or 1.8nm) process technology under the DoD's Rapid Assured Microelectronics...

All the new iPhone series for 2023 are very likely to feature Dynamic Island display technology, but Taiwanese partners in the supply chain, such as camera modules...

Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed...

TSMC has recently initiated a new round of orders with advanced packaging equipment suppliers including Apic Yamada, Disco, Gudeng Precision Industrial and Scientech, according to...

In light of the severe shortage of CoWoS (chip-on-wafer-on-substrate) packaging capacity for AI GPUs now in hot demand, the US and Japan reportedly are aggressively re-inviting TSMC...

Semiconductor backend houses, such as leading OSAT ASE Technology Holdings (ASEH) and test interface specialist Chunghwa Precision Test Tech (CHPT), are expected to see sales growth...