Taiwan-based OSATs, such as ASE Technology and Winstek Semiconductor, have stepped up their silicon photonics (SiPh) deployments and are evaluating its potential in furthering advanced...
Taiwan Semiconductor Manufacturing Co. and Arizona authorities are talking about adding advanced chip packaging capacity to the chipmaker's plants in the state, Governor Katie Hobbs...
Semiconductor material distributors, such as Niching Industrial, Chang Wah Technology (CWTC), Topco Scientific, and Wahlee Industrial, continue to observe relatively stable demand...
IC packaging leadframe suppliers are bracing for on-year profit decreases in 2023, as demand for automotive chips cannot offset the impact of diminishing consumer chip demand, according...
The US should invest more in cutting-edge semiconductor packaging to ensure it leads in emerging technologies such as artificial intelligence, Cadence Design Systems Inc. Chief Executive...
Taiwan-based IC backend houses have witnessed an improvement in their sales performance during the third quarter. However, it is anticipated that a significant rebound in demand may...
Driven by the AI frenzy, high-performance computing (HPC) chips are becoming pivotal in the semiconductor landscape, spotlighting advanced packaging technologies like CoWoS. Heat...
According to Korean media Money S, the South Korean government and major semiconductor firms have signed a "Semiconductor Advanced Packaging Technology Cooperation Development...
In light of the fact that Chinese foundries can still obtain used equipment and consumables for process technology upgrades despite the US ban, the US could target advanced packaging...
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
Advanced packaging and testing technologies shined brightly at SEMICON Taiwan 2023 due to a focus on AI, HPC, and automotive chips. This included various showcases of new products...
Semiconductor material suppliers are among the beneficiaries of robust demand from TSMC, Amkor Technology, and OSATs for CoWoS packaging, according to industry sources.
The shortfall in CoWoS packaging capacity at TSMC is temporary, and demand will be met in one and a half years via capacity expansions, according to company chairman Mark Liu.
InnoCare Optoelectronics (INCX), a subsidiary of panel maker Innolux that specializes in the development of flat panels for medical applications, is collaborating with Smart Chain...
