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NEWS TAGGED TSMC
Wednesday 20 September 2023
Taiwan, US delegations explore cybersecurity, 5G, EV cooperation and investment opportunities at Taipei forum
A Taiwan-US supply chain partnership forum held in Taipei alongside the US Business Day on September 19 saw delegations of government and corporate representatives from both sides...
Wednesday 20 September 2023
TSMC enters agreement with Saxony to foster semiconductor talent
Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) signed an agreement with the Saxon Science Liaison Office Taiwan and TU Dresden on September 19 in Taipei to address the semiconductor...
Wednesday 20 September 2023
Taiwan OSATs step up SiPh deployment
Taiwan-based OSATs, such as ASE Technology and Winstek Semiconductor, have stepped up their silicon photonics (SiPh) deployments and are evaluating its potential in furthering advanced...
Tuesday 19 September 2023
Germany's Saxony to send interns to TSMC to foster chip talent
The German state of Saxony and Taiwan Semiconductor Manufacturing Co. are working together on an exchange program that will bring Dresden students to Taiwan for internships in a push...
Tuesday 19 September 2023
TSMC and Arizona discussing advanced chip packaging investment
Taiwan Semiconductor Manufacturing Co. and Arizona authorities are talking about adding advanced chip packaging capacity to the chipmaker's plants in the state, Governor Katie Hobbs...
Tuesday 19 September 2023
AI boom sparks silicon photonics applications
Silicon photonics technology was hotly discussed during the SEMICON Taiwan 2023. At the Silicon Photonics Global Summit held September 5 alongside the exhibition, I was invited to...
Tuesday 19 September 2023
Packaging material distributors see stable demand for automotive, advanced packaging
Semiconductor material distributors, such as Niching Industrial, Chang Wah Technology (CWTC), Topco Scientific, and Wahlee Industrial, continue to observe relatively stable demand...
Tuesday 19 September 2023
Intel gearing up for glass substrate production for advanced packaging
Intel has announced that its first glass substrate for next-generation advanced packaging will enter mass production between 2026 and 2030.
Monday 18 September 2023
Could Arm rely on licensing customized SoC solutions beyond standard IPs as new profit booster after IPO?
With SoftBank-backed IP giant Arm launching a blockbuster IPO (initial public offering) on the US Nasdaq market on September 14 at a unit share price of US$51, its CEO Rene Haas bears...
Friday 15 September 2023
What has global supply chain restructuring meant for Taiwan?
After the reconfiguration of global supply chains, it will mark the beginning of Taiwan's great navigation era, and the trend of large-scale supply chain relocation has made supply...
Friday 15 September 2023
TSMC Kumamoto fab may profit in 2025
The construction of TSMC's Kumamoto fab in Japan is progressing well. Profits are expected in 2025, following the start of mass production by the end of 2024, according to industry...
Thursday 14 September 2023
TSMC to fulfill more 3nm order commitments in 2024
TSMC has deployed 3nm process technology to mass production with Apple as its first customer, and is gearing up to execute more orders for 3nm chips from other key customers in 2024,...
Wednesday 13 September 2023
Taiwan initiates 10-year chip-driven innovation project to attract global talent, startups
Starting 2024, Taiwan will implement a 10-year chip-driven industrial innovation project aiming to attract young talent and startup teams from around the world to set up operations...
Wednesday 13 September 2023
TSMC to invest in Arm and Intel subsidiary IMS Nanofabrication
TSMC's board of director has approved plans to invest up to US$100 million in Arm, based on Arm's IPO share price. Separately, the board approved the purchase of a minority stake...
Tuesday 12 September 2023
Samsung, SK Hynix to catch up with TSMC in IC packaging with government help
According to Korean media Money S, the South Korean government and major semiconductor firms have signed a "Semiconductor Advanced Packaging Technology Cooperation Development...
2023 Supply Chain Summit
DIGITIMES Research Special Report Databases
Global high-end AI server shipments to soar in 2023, says DIGITIMES Research
In light of Huawei's 5G smartphone launch, US could pose even stricter sanctions, said DIGITIMES Research
Global foundry revenues anticipated to rise for 2024 despite lingering chip demand weakness, says DIGITIMES Research