NAND wafer prices have been on the rise since the start of the third quarter, and NAND flash suppliers are expected to initiate price increases starting in the fourth quarter thanks...
In 2023, global spending on fab equipment for front-end facilities is projected to decrease by 15% before rebounding with a 15% year-over-year increase in 2024, according to a recent...
Memory chipmaker Macronix International has reported August revenue increased 19.2% sequentially to a four-month high of NT$2.6 billion (US$81.1 million), buoyed mainly by a pick-up...
Recent reports from South Korean media pointed out that after high bandwidth memory (HBM), Samsung Electronics will develop a new generation of DRAM technology.
Samsung Electronics has announced the development of what the company claims is the industry's first 32-gigabit (Gb) DDR5 DRAM using 12 nanometer (nm)-class process technology.
As generative AI keeps driving demand for high bandwidth memory (HBM), the global DRAM market landscape is also undergoing changes, with SK Hynix's global DRAM market share exceeding...
Micron's 1-beta DRAM process technology is now in volume production at its fabs in Taiwan, where production of memory chips fabricated using EUV-based 1-gamma process will begin in...
Micron Technology is on track to move EUV-based process manufacturing for DRAM memory to volume production at its factory site in central Taiwan, according to a report by Taiwan's...
The proliferating artificial intelligence (AI) applications are generating significant growth potential in demand for next-generation high bandwidth memory (HBM) chips, driving South...
NAND flash memory suppliers appear determined to raise prices, resulting in a modest increase in spot market prices for August, according to industry sources.
After achieving breakthroughs in production technologies for high bandwidth memory (HBM) and 300-layer NAND flash chips, SK Hynix is accelerating the development of the next-generation...
Although major global memory manufacturers are actively implementing production cuts to suppress the ongoing decline of DRAM and NAND Flash prices and to reduce inventory, the overall...
The 30–40% reduction in output at Winbond Electronics' wafer fab in Taichung (central Taiwan) has been reduced to less than 20%, and the memory chipmaker plans to begin installing...
