Taiwan-based OSATs, such as ASE Technology and Winstek Semiconductor, have stepped up their silicon photonics (SiPh) deployments and are evaluating its potential in furthering advanced...

At the ongoing Intel Innovation 2023 conference, Intel CEO Pat Gelsinger announced a number of the company's important AI progress initiatives, including the upcoming launch of its...

To strengthen its position in data centers, Intel invested US$16.7 billion in 2015 to acquire FPGA manufacturer Altera, actively integrating Xeon processors with FPGA technology,...

Intel has announced that its first glass substrate for next-generation advanced packaging will enter mass production between 2026 and 2030.

Intel's China-specific version of its Habana Gaudi 2 AI processor has seen a sharp rise in demand, according to industry sources.

Intel Innovation 2023 is set to be held in San Jose from September 19–21. Ever since CEO Pat Gelsinger returned to Intel in 2021, he has not only taken on the responsibility...

With SoftBank-backed IP giant Arm launching a blockbuster IPO (initial public offering) on the US Nasdaq market on September 14 at a unit share price of US$51, its CEO Rene Haas bears...

HTC is taking a highly diversified strategy in its operations, strengthening and enriching its VR/AR ecosystem, while at the same time expanding its smartphone lineup to face market...

TSMC's board of director has approved plans to invest up to US$100 million in Arm, based on Arm's IPO share price. Separately, the board approved the purchase of a minority stake...

ChatGPT not only drives the demand for AI servers but also underscores the urgency to adopt high-speed computing applications. However, high-speed computing cannot rely solely on...

To ensure their competitiveness, vertical integration isn't merely a catchphrase for businesses; it's an ongoing imperative. When TSMC focuses on advanced packaging, what's ASE's...

Intel Foundry Services (IFS) and Tower Semiconductor have reached a new agreement in which IFS will provide foundry services and 300mm manufacturing capacity to assist Tower in serving...

These are the most-read news stories in the week of August 28–Sept 1, 2023 on DIGITIMES Asia website:

At this year's Hot Chips event, Intel provided the first in-depth look at its next-generation Intel Xeon product lineup, built on a new, innovative platform architecture.

Intel recently terminating its US$5.4 billion deal to acquire Israel's contract chipmaker Tower Semiconductor after failing to obtain required regulatory approval from China is undoubtedly...