Semiconductor manufacturers worldwide are projected to increase 200mm fab capacity by 14% from 2023 through 2026, adding 12 new 200mm fabs as the industry reaches a record high of...
In 2023, global spending on fab equipment for front-end facilities is projected to decrease by 15% before rebounding with a 15% year-over-year increase in 2024, according to a recent...
IC design houses are bracing for a particularly weak second half of 2023, but expect customer demand to recover substantially in the second half of 2024.
With sequential IC sales declines beginning to moderate, the global semiconductor industry appears to be nearing the end of a downcycle and is expected to begin recovering in 2024,...
GaAs foundry Win Semiconductors saw its loss shrink significantly in the second quarter of 2023, when its fab utilization rates rebounded to around 40%.
Worldwide silicon wafer shipments increased 2.0% quarter-over-quarter to 3,331 million square inches in the second quarter of 2023, down 10.1% from the 3,704 million square inches...
Worldwide sales of semiconductor manufacturing equipment by original equipment manufacturers are expected to rebound to US$87.4 billion in 2024, from a projected 18.6% decline to...
With both summer and the job-seeking season approaching, Semiconductor Equipment and Materials International (SEMI) has launched SEMI University, an online semiconductor learning...
India's foray into the semiconductor sector continues to command attention, although several ambiguities remain for observers that need to be addressed. Following a series of predictions...
Global 300mm fab equipment spending for front-end facilities next year is expected to begin a growth streak to a US$119 billion record high in 2026, following a decline in 2023, according...
Global semiconductor equipment billings increased 9% year-over-year to US$26.8 billion in the first quarter of 2023, SEMI announced today in its Worldwide...
United Microelectronics Corp. (UMC) continues to observe customers adjusting inventory levels, albeit at a slower rate than expected, while cyclical shifts in the business climate...
SEMI, TECHCET, and TechSearch International jointly published "Global Semiconductor Packaging Materials Outlook" report on May 24, predicting that the size of global semiconductor...
As IC packaging trends toward high density and multiple layers, IC substrates that use Ajinomoto Build-up Film (ABF) as an insulation material (also called ABF substrates) are gaining...
