Taiwan-based OSATs, such as ASE Technology and Winstek Semiconductor, have stepped up their silicon photonics (SiPh) deployments and are evaluating its potential in furthering advanced...
The sluggish sales of TVs and notebooks have prompted display driver IC (DDI) backend houses and related backend materials suppliers to be cautious about demand in the second half...
Taiwan's industry supply chain remains competitive in the advanced chip market, which is expected to be undersupplied over the next three to five years, according to Tien Wu, COO...
Taiwan-based optical communications device makers and IC backend houses are looking to capitalize on opportunities presented by the expansion of network broadband infrastructure in...
As semiconductor firms such as IDM Intel and OSAT ASE Technology increase their local investments, packaging and testing supply chains are expanding in Eastern Europe and Southeast...
Leading Taiwan-based OSATs including Powertech Technology (PTI) and ASE Group are reducing prices amid ongoing cost pressures, according to industry sources.
TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs.
Semiconductor backend packaging and testing and mobile phone power amplifier (PA) companies agree that visibility for large-scale orders is still unclear going into the second quarter...
Taiwan-based driver IC OSATs such as ChipMOS Technologies and Chipbond Technology are seeing the monthly operating growth rate of chip and backend companies exceed 20%, according...
Taiwanese OSAT ASE Technology Holding (ASE) continues to enhance its solutions for automotive ICs including sensors, electronic control units (ECU), and power devices, stepping up...
Taiwan-based OSATs, many of which are involved with TSMC and other chipmakers, are considering Mexico as their regional base of operations to assist partners looking to expand into...
IC backend houses warehouses have been filled with "wafer bank" inventories from fabless customers over the last two years, but the pressure has begun to ease, according to AH Liu,...
As fab utilization rates fall due to slowing customer orders, OSATs have implemented cost-cutting measures such as encouraging employees to take leave, according to industry source...
High-performance computing (HPC) chip demand has been difficult for IC test interface solution vendors to predict, but they anticipate recovery could start in the second half of 20...
