Gallium Nitride (GaN) semiconductor company Efficient Power Conversion (EPC) is taking a fresh stab at the power component landscape, challenging the longstanding silicon hegemony...
Gaming continues to be one of the key competitive points of flagship smartphone SoC design in 2023, rather than generative AI as previously emphasized, according to sources.
If Huawei can revive its handset business by rolling out more 5G and other handset-related chips with support from SMIC's 14nm and 7nm manufacturing capability, Qualcomm and MediaTek...
The AI boom has fueled the high-performance semiconductor market. SK Hynix, in light of investment reduction, has elected to expand its HBM technology capabilities through recent...
To enhance the competitiveness of its new generation NAND flash, Samsung Electronics is reportedly going to upgrade its NAND core equipment supply chain in 2024. Samsung has also...
Taiwan's Ministry of Digital Affairs is commencing a project to strengthen domestic communication networks in case of emergencies or wartime and is collaborating with partners including...
Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed...
The K-Network 2030 strategy allotted a KRW625.3 billion (about US$500 million) budget for 6G mobile communication technology research and development from 2024 through 2028, eyeing...
Demand for Ethernet ICs has been increasing rapidly in line with relentless updates of various Internet devices and applications, driving more suppliers, including Taiwan-based IC...
The continuous expansion of TSMC's fab in Taiwan, home to the world's largest pure-play foundry, is essential for preserving the country's supply chain advantages, according to industry...
Samsung Electronics plans to apply its in-house developed advanced packaging technology in 3nm GAA process manufacturing by 2025, but frontend manufacturing yields continue to play...
Samsung Electronics is aggressively incorporating artificial intelligence (AI) to improve its DRAM design and wafer fabrication yield, aiming to boost its product competitiveness...
SK Hynix has begun mass production of its 238-layer 4D NAND flash memory, and product compatibility testing is presently being conducted with a global smartphone manufacturer, according...
MediaTek is partnering with Nvidia to boost its competitiveness in the automotive IC market versus Qualcomm, but Qualcomm believes its extended deployment in the industry will keep...
Intel CEO Pat Gelsinger is in Taiwan for the Intel Vision event, which is aimed at high-level executives and managers from customers and ecosystem partners. In a Q&A with the...
